典型文献
Microstructure and properties of AgCu/2 wt％Ag-added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering
文献摘要：
The purpose of this paper is to investigate the effect of 2 wt％Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb and 62Sn36Pb2Ag solder pastes were used to join Cu(1.7 wt％-2.5 wt％)Be and Ag(2 wt％-5 wt％)Cu alloys.Two fracture modes are observed in 62Sn36Pb2Ag and 63Sn37Pb joints after lateral shear tests at room temperature or 120℃,and shear forces of 62Sn36Pb2Ag joints are far higher than those of 63Sn37Pb joints.No obvious difference is observed in morphology and thickness of intermetallic compounds(IMCs)at interfaces of the 63Sn37Pb and 62Sn36Pb2Ag joints.Within the two kinds of joints,for-mation of big blocky or plate-like Ag3Sn is restrained.However,many Ag3Sn IMCs particles(1-3 μm in width)in isolated and dispersed distribution are observed within 62Sn36Pb2Ag joints.The Ag3Sn particles are responsible for the better mechanical properties of 62Sn36Pb2 Ag joints than those of 63Sn37Pb joints.The results present in this paper may provide a guide for restraining formation of big blocky or plate-like Ag3Sn in joints with Ag pads or thick Ag surface finish on pads by utilizing vapor phase soldering process,and improving mechanical properties of Cu/SnPb/Ag joints by adding Ag in SnPb eutectic solder.
文献关键词：
中图分类号：
作者姓名：
Wei Liu;Rong An;Ying Ding;Chun-Qing Wang;Yan-Hong Tian;Kun Shen
作者机构：
State Key Laboratory of Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;School of Engineering and Physical Sciences,Heriot-Watt University,Edinburgh EH14 4AS,UK;Key Laboratory of Micro-systems and Micro-structures Manufacturing,Ministry of Education,Harbin Institute of Technology,Harbin 150001,China;Beijing Institute of Control Engineering,Beijing 100190,China
文献出处：
引用格式：
[1]Wei Liu;Rong An;Ying Ding;Chun-Qing Wang;Yan-Hong Tian;Kun Shen-.Microstructure and properties of AgCu/2 wt％Ag-added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering)[J].稀有金属（英文版）,2022(06):1983-1988
A类：
CuBe,62Sn36Pb2Ag,62Sn36Pb2,SnPb
B类：
Microstructure,properties,AgCu,wt,added,joints,fabricated,by,vapor,phase,soldering,purpose,this,paper,investigate,effect,addition,eutectic,microstructure,mechanical,63Sn37Pb,pastes,were,used,alloys,Two,fracture,modes,are,observed,after,lateral,shear,tests,room,temperature,forces,far,higher,than,those,No,obvious,difference,morphology,thickness,intermetallic,compounds,IMCs,interfaces,Within,two,kinds,big,blocky,plate,like,Ag3Sn,restrained,However,many,particles,width,isolated,dispersed,distribution,within,responsible,better,results,present,may,provide,guide,restraining,formation,pads,surface,finish,utilizing,process,improving,adding
AB值：
0.388486
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