典型文献
Profiling interfacial reaction features between diamond and Cu-Sn-Ti active filler metal brazed at 1223 K
文献摘要:
Diamond/Cu-Sn-Ti composites have been successfully prepared by cold-press forming in conjunction with high-temperature vacuum active brazing at 1223 K.Ensuing wetting behaviors between diamond and filler metal,interfacial characteristics of the reaction layer,and wear resistance of the bulky composite have been fully investigated.It is revealed that all diamond particles can only be fully coated when the TiH2 content exceeds 5 wt%,below which sharp edges on diamond can still be observed.The interfacial reaction layer is found to be composed of TiC,the thickness of which is demonstrated to increase as a function of TiH2 content,arriving at the peak value of 1.70 pm and remaining almost constant afterwards.It is further shown that the maximum wear resistance occurs approaching 5 wt%TiH2 content.Potential mechanisms responsible for such interesting phenomena have been postulated.
文献关键词:
中图分类号:
作者姓名:
Yonggang Fan;Kenan Li;Haodong Li;Cong Wang
作者机构:
Key Laboratory for Ecological Metallurgy of Multimetallic Mineral(Ministry of Education),School of Metallurgy,Northeastern University,Shenyang 110819,China;State Key Laboratory of Superabrasives,Zhengzhou Research Institute for Abrasives&Grinding Co.,Ltd.,Zhengzhou 450001,China;State Key Laboratory of Solid Lubrication,Lanzhou Institute of Chemical Physics,Chinese Academy of Sciences,Lanzhou 730000,China
文献出处:
引用格式:
[1]Yonggang Fan;Kenan Li;Haodong Li;Cong Wang-.Profiling interfacial reaction features between diamond and Cu-Sn-Ti active filler metal brazed at 1223 K)[J].材料科学技术(英文版),2022(36):100-105
A类:
Ensuing
B类:
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AB值:
0.607972
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