典型文献
Study on the performance of silver paste sintered sealing joints for hermetic packaging
文献摘要：
The traditional hermetic packaging methods, which require high temperatures and high voltages, would have adverse effects on electronics devices. Based on current-assisted sintering technology, we proposed a new hermetic packaging method using silver paste. Com-paring the microstructure of the joints sintered with different currents, we found that with the increasing sintering current from 4.7 kA to 5.3 kA, the density of the joint increases, which improves the hermeticity and bonding strength of the joints. The results of thermal cycling tests showed that the sealing joints sintered at 4.7 kA with larger porosity are more prone to fail because pores tend to be sources of defects under thermal cycling. After 250 ℃ high thermal storage, there is the coarsening of the pores and the delamination near the Ag/Au interface, degrading the sealing performance of the sintered joint. Besides, the sealing joints sintered at 5.3 kA exhibit superior reliability when ex-posed to high temperatures.
文献关键词：
中图分类号：
作者姓名：
林丽婷;章永飞;李欣
作者机构：
文献出处：
引用格式：
[1]林丽婷;章永飞;李欣-.Study on the performance of silver paste sintered sealing joints for hermetic packaging)[J].中国焊接（英文版）,2022(01):29-36
A类：
hermetic,hermeticity
B类：
Study,performance,silver,paste,sintered,sealing,joints,packaging,traditional,methods,which,require,high,temperatures,voltages,would,have,adverse,effects,electronics,devices,Based,assisted,sintering,technology,proposed,new,using,Com,paring,microstructure,different,currents,found,that,increasing,from,kA,density,increases,improves,bonding,strength,results,thermal,cycling,tests,showed,larger,porosity,are,more,prone,fail,because,pores,tend,sources,defects,under,After,storage,there,coarsening,delamination,near,Ag,Au,interface,degrading,Besides,exhibit,superior,reliability,when
AB值：
0.513235
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